Damascene Patterned Metal/adhesive Wafer Bonding for Three-dimensional Integration

Damascene Patterned Metal/adhesive Wafer Bonding for Three-dimensional Integration

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The feasibility of a new 3D integration technology platform has been demonstrated with critical unit processes characterized. Key results include the demonstration of inter-wafer via-chains, material characterization for partially cured BCB for this new bonding application, and quantification of topography accommodation.By using damascene patterned copper/BCB as a bonding surface, inter-wafer interconnection and mechanically robust wafer bonding can be achieved in a single unit process step. Figure 3.1 shows a schematic diagram of the metal/ adhesiveanbsp;...


Title:Damascene Patterned Metal/adhesive Wafer Bonding for Three-dimensional Integration
Author:J. Jay McMahon
Publisher:ProQuest - 2008
ISBN-13:

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