Development tools handbook

Development tools handbook

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Ceramic dual in-line package Intel type C. Ceramic flatpack package Intel type F; Ceramic leadness chip carrier Intel type R; Ceramic pin grid array package Intel type A; Ceramic pin grid array module; Ceramic quadpack package Intel type Q; Cerdip dual in-line package Intel type D; Cerquad package; Plastic dual in-line package Intel type P; Plastic fine pitch chip carrier; Plastic leaded chip carrier package Intel type N; Plastic flatpack package Intel type P.Figure 1. SDK-86 System Design Kit Functional Block Diagram IB 10 I a€” p I pwbqqppm | a#39;uonu I. FUNCTIONAL ... 8086 Processor Communications Interface The SDK-86 is designed around Intela#39;s 8086 microprocessor. The Intel 8086 is a newanbsp;...

Title:Development tools handbook
Author:Intel Corporation
Publisher:Intel Corporation (CA) - 1987-02


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