Failure Modes and Mechanisms in Electronic Packages

Failure Modes and Mechanisms in Electronic Packages

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This text illustrates the fundamental causes of failures such as design, materials, and manufacturing processes, offers prevention methods through failure analysis, and provides design, material, and process improvements in electronics packaging. A detailed account of the failures of device packages, discrete components connectors, PCB carriers, and PCB assemblies are presented. Real life examples of failures commonly observed in the packaging industry as well as surveys of various failure models are also outlined in the book.This text illustrates the fundamental causes of failures such as design, materials, and manufacturing processes, offers prevention methods through failure analysis, and provides design, material, and process improvements in electronics ...


Title:Failure Modes and Mechanisms in Electronic Packages
Author:Puligandla Viswanadham, P. Singh
Publisher:Springer Science & Business Media - 1998
ISBN-13:

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