Materials and Process Characterization

Materials and Process Characterization

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VLSI Electronics: Microstructure Science, Volume 6: Materials and Process Characterization addresses the problem of how to apply a broad range of sophisticated materials characterization tools to materials and processes used for development and production of very large scale integration (VLSI) electronics. This book discusses the various characterization techniques, such as Auger spectroscopy, secondary ion mass spectroscopy, X-ray topography, transmission electron microscopy, and spreading resistance. The systematic approach to the technologies of VLSI electronic materials and device manufacture are also considered. This volume is beneficial to materials scientists, chemists, and engineers who are commissioned with the responsibility of developing and implementing the production of materials and devices to support the VLSI era.A summary of comb and serpentine test structures is shown in Figure 13. ... Schematic diagrams of various comb and serpentine resistors used to evaluate electromigration, metal corrosion, layout rules, and leakage currents. tures becauseanbsp;...

Title:Materials and Process Characterization
Author:Norman G. Einspruch, Graydon B. Larrabee
Publisher:Academic Press - 2014-12-01


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