The continued scalling of physical dimentions in the integrated-circuits industry necessitates the introduction of novel materials, processes, integration schemes and packages. This volume brings together leading modelers and experimentalists to discuss the plethora of process and reliability issues associated with depositing.The hardness persists after 450 C annealing. An increase of dielectric constant up to 9% ... XRUMP and Genplot software manual (Computer Graphics Service, 1996). http://www.genplot.com/doc/index.html Mater. Res. Soc. Symp. Proc. Vol.
|Title||:||Materials, technology and reliability for advanced interconnects--2005|
|Author||:||Paul R. Besser, Materials Research Society. Meeting|