Power Electronic Packaging

Power Electronic Packaging

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also: Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designs Power Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.See Insulated gate bipolar transistor (IGBT) Ikeda, T., 304 Inductance checklist, 523a€“524 simulation procedure, 519a€“523 ... 173a€“174 Junction-to-case thermal resistance test, 173 K KFC-H lead frame enlongation vs. temperature, 274, 275, 277anbsp;...

Title:Power Electronic Packaging
Author:Yong Liu
Publisher:Springer Science & Business Media - 2012-02-15


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