Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.Interconnection reliability analysis has not been a solid part of the product reliability concept. ... This can be verified from the MIL-HDBK-217F (1991), where the empirical data-based solder joint base hazard rates are given by 41 failures ... new technologies that do not have field experience are taken in to the new product designs with accelerating pace. ... In order to gain the trust to the new technology, powerful and user-friendly applications for failure estimates must be taken into use.
|Title||:||Reliability of Microtechnology|
|Author||:||Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson|
|Publisher||:||Springer Science & Business Media - 2011-02-07|