Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study... a discrete interconnect from the mid-plane of the structure Mathematical symbols aamp;21 AT As = S 6ks = =2 */De a€“ D51/X, ... D2 D1 Ks1 + Ks2 for bilayer structure k = { ki, Stresses in solder joints due to the bending deformation of printed circuitanbsp;...


Title:Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author:E-H Wong, Y.-W. Mai
Publisher:Woodhead Publishing - 2015-05-23
ISBN-13:

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